產(chǎn)品技術(shù)
產(chǎn)品技術(shù)
華天科技半導(dǎo)體封測一站式服務(wù)商

當(dāng)前位置：首頁-產(chǎn)品技術(shù)-Memory

華天科技存儲封裝包含TSSOP，DFN，LGA，BGA封裝，產(chǎn)品線涵蓋Nor Flash，SPI NAND，SD NAND，3D V-NAND，eMMC，eMCP，UFS，LPDDR，DDR系列，滿足客戶高密度高速度

存儲封裝需求。

Memory產(chǎn)品類別：FLASH   |   DRAM  |   Embedded

1.png

1578712249(2).jpg

應(yīng)用領(lǐng)域

Solid state disk or USB flash disk 手機(jī)、車載、智能家居等多個領(lǐng)域。

代表產(chǎn)品

  • 3D-VNAND
    3D-VNAND

    Specification:
    Package Size: 12x18mm 132Ball
    Package thickness：1.12mm /1.32mm
    Min Die thickness: 30um
    8 die –stack/16 die –stack
    Substrate thickness:0.13mm

    Application:
    Solid state disk or USB flash disk

  • LPDDR4
    LPDDR4

    Specification:
    Package Size: 10x14.5mm 200Ball
    Package thickness： 0.92mm
    Min Die thickness: 40um
    2 die –stack/4 die –stack
    Substrate thickness:0.18mm 2L/4L

    Application:
    Mobile electronics DRAM

  • eMMC
    eMMC

    Specification:
    Package Size: 11.5x13mm 153 Ball
    Package thickness： 0.92mm
    Min Die thickness: 80um
    2 die –stack
    Substrate thickness:0.18mm 2L

    Application:
    Mobile phone, Flat PC, Smart Watch 

  • eMCP
    eMCP

    Specification:
    Package Size: 8x10.5mm 162Ball
    Package thickness： 0.92mm
    Min Die thickness: 80um
    3 die –stack
    Substrate thickness:0.18mm 2L

    Application:
    Mobile phone, Flat PC,IoT, Wearable device

思思久久国产精品丝袜,国产成人无码综合,久久久久国产综合精品,国产精品毛片久久久久久久AV